oru.sePublications
Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Flip chip as an enabler for MEMS packaging
Örebro University, School of Science and Technology.
IMEGO, Gothenburg, Sweden.
Örebro University, School of Science and Technology.ORCID iD: 0000-0002-0718-8080
2002 (English)In: 52nd Electronic Components and Technology Conference, 2002. Proceedings., 2002, p. -128Conference paper, Oral presentation with published abstract (Refereed)
Abstract [en]

With the recent trends in microelectronics to move more and more towards incorporating MEMS (micro electro mechanical systems) structures, lowering the overall cost becomes vital. One major cost driver in today's MEMS is the packaging. Many of the MEMS structures require some level of low pressure for full quality operation, and some may even need vacuum to function properly. Different MEMS packaging strategies exist on the market and they can be divided into two different approaches. The first one protects the wafer temporarily during wafer scribing or dicing and the second one provides a permanent seal to the wafer through full wafer bonding before scribing and dicing. The latter, permanent methods allows for selecting very low cost packaging without hermeticity as a requirement, whereas in the temporary seal methods the seal is removed after dicing and the sensitive structures become unprotected again. Using flip chip for MEMS has the benefit of providing MEMS structures with a covering lid, the chip itself. A number of flip chip MEMS interconnection methods presented in literature are described.

Place, publisher, year, edition, pages
2002. p. -128
Series
IEEE Conference Publications, ISSN 0569-5503
Keywords [en]
Flip chip, MEMS
National Category
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
URN: urn:nbn:se:oru:diva-40035DOI: 10.1109/ECTC.2002.1008084ISBN: 0-7803-7430-4 (print)OAI: oai:DiVA.org:oru-40035DiVA, id: diva2:774711
Conference
Electronic Components and Technology Conference. San Diego, USA. May 31, 2002.
Available from: 2014-12-28 Created: 2014-12-28 Last updated: 2018-10-31Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full text

Authority records BETA

Boustedt, KatarinaStranneby, Dag

Search in DiVA

By author/editor
Boustedt, KatarinaStranneby, Dag
By organisation
School of Science and Technology
Other Electrical Engineering, Electronic Engineering, Information Engineering

Search outside of DiVA

GoogleGoogle Scholar

doi
isbn
urn-nbn

Altmetric score

doi
isbn
urn-nbn
Total: 339 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf